{"id":25,"date":"2026-08-31T18:01:24","date_gmt":"2026-08-31T10:01:24","guid":{"rendered":"http:\/\/wh-nu7wehbv22kcbyp04h6.my3w.com\/?page_id=25"},"modified":"2026-08-31T18:01:24","modified_gmt":"2026-08-31T10:01:24","slug":"equipment-inspection","status":"publish","type":"page","link":"https:\/\/www.ebestpcba.com\/index.php\/equipment-inspection\/","title":{"rendered":"PCBA Testing & Inspection Equipment"},"content":{"rendered":"\n
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Home<\/a> \/ Capabilities<\/a> \/ Testing & Inspection<\/div>\r\n
Inspection Coverage and Records<\/div>\r\n

PCBA Testing & Inspection Equipment<\/h1>\r\n

Match each PCBA risk with the appropriate SPI, AOI, X-ray, or project-defined test method. EBest PCBA confirms inspection coverage, acceptance criteria, and required records from your project files before quotation.<\/p>\r\n

Send Gerber, BOM & Test Requirements<\/a>Request NDA First<\/a><\/div>\r\n
3D SPI<\/b>Paste control<\/span>3D AOI<\/b>Visible defects<\/span>X-ray<\/b>Hidden joints<\/span>ICT \/ FCT<\/b>Project-defined<\/span><\/div>\r\n<\/div>\r\n
Representative inspection context<\/span>
X-ray inspection of hidden solder-joint conditions based on the agreed inspection plan.<\/figcaption><\/figure>\r\n<\/div>\r\n<\/section>\r\n
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Inspection Method Selection<\/div>

Match the Inspection Method to the Failure Risk<\/h2><\/div>

No single inspection method covers every defect. Start with the failure risk, then define the inspection method, required record, and acceptance criteria before production.<\/p><\/div>\r\n

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Inspection Risk \/ Requirement<\/th>Primary method<\/th>Typical evidence<\/th>Confirm Before Quotation<\/th><\/tr><\/thead>
Paste volume, area, offset or bridging<\/td>3D SPI<\/span><\/td>Measurement result and flagged location<\/td>Paste limits, control plan and record requirement<\/td><\/tr>\r\n
Missing, wrong, shifted or visibly defective components<\/td>3D AOI<\/span><\/td>Reference designator, image and disposition<\/td>Approved BOM, centroid data and component library<\/td><\/tr>\r\n
BGA, QFN and other hidden solder joints<\/td>X-RAY<\/span><\/td>Inspection image and identified condition<\/td>Package scope, void criteria, sampling and report delivery<\/td><\/tr>\r\n
First-board component value and reference match<\/td>FAI<\/span><\/td>First-article verification record<\/td>BOM revision, approved alternates, and approved assembly data<\/td><\/tr>\r\n
Open, short or component-level electrical checks<\/td>ICT \/ FLYING PROBE<\/span><\/td>Project-defined electrical test result<\/td>Test access, coverage, fixture and ownership<\/td><\/tr>\r\n
Product behavior, interfaces and operating limits<\/td>FCT<\/span><\/td>Project-defined functional test result<\/td>Firmware, fixture, procedure, limits and golden sample<\/td><\/tr>\r\n<\/tbody><\/table><\/div>\r\n<\/div><\/section>\r\n
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Published equipment references<\/div>

PCBA Inspection Equipment and Typical Uses<\/h2><\/div>

Equipment selection depends on the package, defect type, and records required for the project. The specifications below are reference values; final equipment selection is confirmed from the board and assembly requirements.<\/p><\/div>\r\n

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Paste and visible-joint control<\/small>

3D SPI & 3D AOI<\/h3>

SPI checks solder-paste conditions before placement; AOI evaluates visible component and solder-joint conditions after assembly.<\/p>