SMT PLACEMENT
Fine-Pitch Placement
01005 / BGA reviewPlacement accuracy, feeder plan, component mix and board support are confirmed from the actual files.
PCBA Assembly Capability
PCBA Assembly for Prototypes and Mass Production
Send your Gerber files, BOM, and placement data. We will check the SMT/THT process, inspection, testing, and traceability needs before quoting.
We aim to reply within 24 hours. Lead time, capacity, testing, and acceptance criteria are confirmed after we check your files.
01005 + BGApublished fine-pitch placement and 0.4 mm BGA reference
115,000 CPHpublished combined placement equipment rate
SPI / AOI / X-rayinspection routes connected to package and solder-joint risk
15-year recordstraceability retention on supported programs
Use these figures for a first check. Actual output and lead time depend on your board, components, quantity, and test needs.
Manufacturing capability matrix
PCBA Assembly Capabilities
Use this table to see whether your SMT, THT, BGA, inspection, testing, and traceability needs are within our stated capabilities.
| Review Item | Standard Capability | Project Requirements |
|---|---|---|
| Build model | Full-turnkey, partial-turnkey or consigned material. | BOM ownership, approved sources, shortages, excess material and incoming inspection responsibility. |
| Volume route | No MOQ; prototype, pilot and repeat builds across the published 1 pc to 100K+ range. | Panel format, line loading, material status, inspection plan and schedule. |
| Assembly process | Single- and double-sided SMT, THT and mixed-technology assembly. | Process sequence, heat-sensitive parts, hand operations, selective soldering and cleaning. |
| Component window | 01005 placement; 0.4 mm BGA is the standard public production reference. | Land pattern, stencil strategy, component data, warpage, paste selection and X-ray route. |
| Board format | Long-format boards up to 1,200 mm can be processed, depending on board design and process requirements. | Board width, thickness, tooling rails, panel support, conveyor path, fiducials and depaneling. |
| Assembly standard | Published IPC Class 2/3 support. | Applicable revision, workmanship class, customer drawings, deviations and acceptance criteria. |
| Inspection | 3D SPI, 3D AOI, first article inspection and X-ray for hidden joints as specified. | Coverage, sampling, measurement limits, defect disposition and report deliverables. |
| Testing and finish | Available services include ICT, functional testing, firmware loading, serialization, and conformal coating for boards up to 700 × 400 mm. | Test method, fixture, software, limits, coating keep-outs, cure route and ownership. |
| Traceability | Material and process records retained for 15 years on supported programs. | Required record fields, customer-facing reports, serial structure and retrieval route. |
Does your assembly sit inside this window?Send the files you have. Engineering will identify the open capability and acceptance questions.
Check My Assembly
SMT, inspection and test equipment
Equipment for Placement, Inspection, and Testing
3D SPI / AOI
SPI and AOI Inspection
Paste and solder-joint controlSPI and AOI help verify paste, placement, polarity and visible solder conditions before release.
X-RAY
Hidden joint inspection
BGA and bottom-terminated packagesX-ray is applied where solder joints cannot be fully confirmed by optical inspection.
ICT / FCT
Electrical and functional release
Fixture, limits and test ownershipProject-defined tests are confirmed with fixtures, software, limits and outgoing records.
Manufacturing route
From Files to Production
Files
Gerber / ODB++, BOM, centroid and drawings.
BOM
Turnkey, partial-turnkey or consigned model.
SMT / THT
Stencil, placement, reflow and hand operations.
Inspect
SPI, AOI, X-ray and first article evidence.
Test
ICT, FCT, programming or customer-defined route.
Release
Records, traceability and outgoing acceptance.
Repeat-build control
What We Record for Traceability
For supported projects, material and process records can be kept for 15 years. Tell us which records and compliance documents you need before production.
Review quality and traceabilityMaterial identity
Approved source, lot, date code and receiving status where included in the program.
Process route
Records can include the program, production line, reflow profile, and inspection steps used for the order.
Inspection results
SPI, AOI, X-ray, first-article or test records according to the defined coverage.
Release identity
Work order, serialization, disposition and outgoing records tied to the accepted product route.
Representative build profiles
Four Common PCBA Manufacturing Types
These are representative capability profiles, not customer case studies or guaranteed outcomes. Final process and acceptance rules follow review of the actual files.
01 / TRACEABILITY
Medical and long-lifecycle control PCBA
Stable BOM control, documented changes, inspection records and repeat-build discipline become the primary release concerns.
- Review focus
- Material lifecycle, records, change control
- Likely evidence
- FAI, AOI/X-ray plan, traceability set
02 / HIGH-DENSITY SMT
Fine-pitch and BGA assembly
Stencil, placement, reflow, hidden-joint inspection and component risk need to be reviewed as one process window.
- Review focus
- Fine pitch, BGA, thermal mass, X-ray
- Likely evidence
- SPI, first article, profile, X-ray
03 / MIXED TECHNOLOGY
SMT and through-hole assembly
SMT and through-hole assembly combines automated and manual processes, including selective soldering, component polarity checks, mechanical support, and functional testing.
- Review focus
- THT, connectors, fixtures, manual steps
- Likely evidence
- Visual criteria, AOI, ICT/FCT, OQC
04 / TEST RELEASE
Programmed and function-tested PCBA
Electrical tests, firmware loading, fixtures, limits and customer-defined acceptance rules are confirmed before release.
- Review focus
- ICT/FCT, firmware, fixture ownership
- Likely evidence
- Test record, limits, outgoing report
Quote-ready inputs
Send the Files You Have
We can start with partial files. Production starts only after the complete file set is approved.
01Board data
Gerber or ODB++, drill, stack-up and panel information.
02Assembly data
BOM, pick-and-place file, assembly drawing and special process notes.
03Commercial context
Prototype, pilot or repeat quantity, target schedule and delivery expectations.
04Acceptance requirements
IPC class, inspection, testing, traceability, coating, serialization and reports.
Decision path
Explore Our Manufacturing Capabilities
Use the related pages to move from commercial scope to manufacturing, inspection and compliance evidence.
SERVICE
Turnkey PCBA Assembly
Review build models, quotation scope and production handoffs.
Open service page → EQUIPMENTInspection Equipment
Connect SPI, AOI, X-ray, ICT and FCT claims with the inspection route.
Review equipment → QUALITYQuality & Traceability
Confirm who approves changes, which inspections are completed, which records are retained and who authorizes shipment.
Review quality system → COMPLIANCECertifications
Review available certification and supplier-evaluation information.
Review compliance →Engineering review before quotation
Check the Assembly Requirements Before Comparing Prices
Send Gerber or ODB++, BOM, placement data, quantities and test requirements. Partial information is enough to start identifying open questions.
FAQ
Questions Engineers and Buyers Ask Before Sharing PCBA Files
Final capability and acceptance decisions are based on the actual manufacturing package.
What files should I send for a PCBA capability review?
Send the available Gerber or ODB++ data, BOM, pick-and-place file, assembly drawing, target quantities, test requirements and any workmanship or compliance requirements. EBest PCBA can begin with partial information and identify what is still needed.
Can EBest PCBA assemble 01005 components and fine-pitch BGA packages?
Yes. We can place 01005 components and fine-pitch BGAs. Final approval depends on the land pattern, stencil design, component data, board design and inspection method.
When is X-ray inspection used for PCBA?
X-ray is used where solder joints are hidden or cannot be fully assessed by optical inspection, including BGA and other bottom-terminated packages. The exact sampling or inspection plan is agreed for the project.
Can EBest PCBA provide ICT or functional testing?
Yes, when the test method, fixture, program, limits and acceptance criteria are defined. Responsibilities and fixture costs are confirmed before production release.
Can customers consign components or use a partial-turnkey model?
Yes. Full-turnkey, partial-turnkey and consigned-material models are supported. BOM ownership, approved sources, incoming inspection and shortage responsibilities are confirmed during quotation.
How is repeat-build traceability maintained?
Supported programs can retain material and process records for 15 years. The exact record set and customer-facing deliverables are confirmed as part of the approved quality and traceability plan.