Rigid islands in one build
Connect component areas without using separate PCBs and cables for each section.
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Rigid-flex manufacturing capability
Rigid-Flex PCB Manufacturing
Combine rigid component areas and flexible interconnects in one PCB for compact assemblies. EBest PCBA reviews the rigid and flex stack, transition zones, via structure and assembly requirements to prepare your fabrication quote.
We aim to provide an initial response within 12 hours. Final construction, inspection scope, pricing and production lead time are confirmed after file review.
Routine Layers2–10 layersConstruction confirmed against the regional stack-up.
Higher-Layer BuildsUp to 50 layersSubject to complete stack-up and process review.
Manufacturing Thickness0.30–4.0 mmRigid and flex regional thicknesses confirmed separately.
Controlled Impedance±10% / ±5 Ω>50 Ω / ≤50 Ω; regional verification agreed.
Project fit
Rigid-Flex for Compact Assemblies
Rigid-flex can reduce separate board-to-board connections and support compact three-dimensional layouts. The design still needs approved bend conditions, transition geometry, mounting support and assembly access.
Defined bend and fold zones
Confirm bend radius, fold direction, trace direction, and mechanical keep-outs before fabrication.
Fewer Separate Connections
Replace selected cables and connectors with integrated flex interconnects where the product design allows.
PCB and PCBA handoff
Review carriers, connectors, component keep-outs, and flex handling before PCBA assembly.
Capability boundary
Rigid-Flex PCB Manufacturing Capabilities
The complete rigid-flex stack and mechanical requirements determine the approved construction. Compare the references below with your regional thickness, routing and assembly needs.
| Capability | Production Reference | Conditions / Special Review |
|---|---|---|
| Layer count | 2–10 layers for routine constructions | Higher-layer constructions up to 50 layers, subject to review of the complete stack-up, registration, materials and via structure. |
| Flex-layer position | Outer-layer and middle-layer options | Position follows the approved copper, coverlay, bend conditions and assembly sequence. |
| Manufacturing thickness | 0.30–4.0 mm reference | The finished-board range does not define flex-region thickness. Rigid, flex and reinforced regions are specified separately in the approved stack-up. |
| Regional thickness | Rigid and flex thicknesses defined separately | One supported route lists rigid areas at 0.25–3.0 mm and flex areas from 0.13 mm. Final regional thicknesses and tolerances are confirmed for the selected construction. |
| Minimum flex-region width | 2.0 mm reference | This is a region-width reference, not a bend-radius limit. Mechanically constrained regions require review. |
| Finished size | Minimum: 5 × 10 mm; maximum: 500 × 500 mm on supported constructions | Separate long-board routes list 210 × 780, 210 × 800 or 210 × 1000 mm; selected builds up to 210 × 1100 mm require review. Size limits belong to their respective production routes. |
| Conductor thickness | 0.5–2 oz reference (18–70 μm) | Applies to selected constructions; base copper, finished copper, minimum geometry and bend requirements are confirmed together. |
| Adhesive polyimide core | PI: 0.5, 1 and 2 mil; copper: 0.33, 0.5 and 1 oz | Other material grades and combinations subject to availability and stack-up review. |
| Adhesiveless polyimide core | PI: 0.5, 1, 2 and 3 mil; copper: 0.33, 0.5, 1 and 2 oz | Material family, copper type and bend suitability confirmed with the construction. |
| Flex dielectric thickness — excluding copper | 12, 18, 25, 50, 75, 100, 125 and 150 μm | FCCL dielectric options; adhesive and coverlay thicknesses are defined separately. |
| Rigid laminate | FR4 grades selected for the design | Special rigid materials reviewed for availability and thermal, electrical and processing compatibility. |
| Rigid core thickness — excluding copper | 0.10, 0.12, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 0.60, 0.80, 1.0, 1.2, 1.6 and 2.0 mm | CCL core options; these values are not the complete finished-board thickness. |
| Inner-layer line / space — 18 μm finished copper | 3 / 3 mil before compensation | Special process: 2.5 / 2.5 mil; localized 2 / 2 mil features subject to review. |
| Inner-layer line / space — 35 μm finished copper | 4 / 4 mil before compensation | Special process: 3.5 / 3.5 mil; geometry confirmed with copper and stack-up. |
| Inner-layer line / space — 70 μm finished copper | 6 / 8 mil before compensation | Special process: 5.5 / 7 mil; geometry confirmed with copper and stack-up. |
| PTH / NPTH diameter tolerance | PTH: ±3 mil; NPTH: ±2 mil | Finished hole size and acceptance requirements are confirmed on the fabrication drawing. |
| Hole position tolerance | ±4 mil reference | Positioning datums and applicable features are confirmed by drawing. |
| PTH wall copper thickness | 15 μm reference | Hole-wall copper and inspection requirements are agreed for the construction and acceptance standard. |
| Through-hole aspect ratio | 8:1 maximum reference | Applies to supported through-hole constructions; hole type, diameter and regional board thickness are reviewed together. |
| HDI structures | 1+N+1 reference, subject to stack-up review | Higher-order build-ups and special via combinations evaluated against the regional stack and via map. |
| Controlled impedance | Target >50 Ω: ±10%; target ≤50 Ω: ±5 Ω | Impedance targets, applicable regions, coupons and measurement methods are agreed for the approved construction. |
| Coverlay | Shengyi SF305C, Taiflex FHK and DuPont FR series | Film, adhesive thickness and openings selected for the approved stack; availability confirmed before production. |
| Bonding adhesive | 25 μm reference | 10 μm and 40 μm options subject to material and construction review. |
| Low-flow prepreg | 40, 60, 80 and 100 μm options | Grade, thickness and resin movement reviewed around rigid-flex boundaries. |
| PI stiffener | 3, 5, 7 and 9 mil options | Local support, connector fit and total regional thickness confirmed by drawing. |
| Electrical test pad spacing | 4–5 mil minimum | Special process: 4 mil; test access and method confirmed for the design. |
| Surface finish | ENIG, flash gold, gold plating, hard gold fingers, OSP and electroplated tin | Selective gold plating, ENEPIG and ENIPIG subject to project review. Contact areas, coating specifications and regional compatibility are confirmed by drawing. |
Capabilities depend on the selected production route and approved construction. Maximum layer count, minimum geometry, copper and circuit size are reviewed together. Bend conditions and qualification scope are agreed for the project.
Architecture choices
Rigid-Flex Construction Options
Rigid-flex construction should be selected based on how the product will be installed, folded, assembled, and tested. More complex structures may need additional engineering review.
Two rigid zones with one flex link
For a defined fold between two supported component areas.
Multiple rigid islands
For assemblies with several supported component areas and planned flex connections.
Outer or middle flex layers
Flex-layer position is selected based on protection, assembly access, copper geometry, and lamination requirements.
Selected HDI Rigid-Flex
For dense routing where the via map and sequential build-up are approved.
Material system
Rigid and Flex Materials in One Stack
The rigid laminate, polyimide, copper, coverlay and bonding materials are selected together. The drawing defines rigid boundaries, flexible areas, local thickness and the assembly envelope.
FR4 and selected special rigid materials are reviewed against thermal, electrical and thickness requirements.
Adhesive or adhesiveless polyimide cores and copper options are selected for the flexible regions.
Low-flow prepreg or adhesive must limit resin movement around rigid-flex transitions and openings.
Coverlay, PI support, local reinforcement and pressure-sensitive adhesive are coordinated with assembly.
Transition-zone control
Rigid-Flex Transition Design
Define fold direction, bend radius, clamp positions and static or dynamic use. We check conductor routing, coverlay overlap, resin movement, holes and support around the transition against the approved construction.
- Keep plated holes and high-stress features away from the transition where the construction requires clearance.
- Avoid abrupt trace-direction or width changes and sharp internal corners in bend areas.
- Coordinate coverlay, low-flow bonding material and rigid opening to control support and resin movement.
- Define whether the flex area is installed once or moves during service; do not assume a generic cycle life.
Bend and movementStatic or dynamic use, radius, direction, angle, target cycles and operating conditions.
Transition geometryDefine rigid boundaries, conductor clearances, hole locations and their measurement references.
Coverlay and bondingConfirm overlap, adhesive thickness, support and resin movement around the transition.
Assembly supportSpecify clamp positions, component clearances, connector locations and fixtures.
Rigid-flex DFM review
Rigid-Flex DFM Review
We mark affected regions and identify the geometry, material or handling issue that needs clarification. The review covers regional stack-up, transition features, via placement, impedance, bend conditions and assembly support.
Stack and layer mapping
Confirms rigid, flexible and adhesive layers, copper weights, coverlay and overall thickness.
Transition geometry
Reviews conductor clearance, resin flow, support, openings and corner radii at the boundary.
Hole and via strategy
Check PTH, buried vias, and laser vias against the transition zone, copper construction, and HDI requirements.
Flex routing and bend
Examines trace direction, width changes, bend area, fold orientation and mechanical constraints.
Impedance regions
Coordinates trace geometry and dielectric behavior across rigid and flexible stack sections.
Assembly support
Plans tooling, carriers, component keep-outs, connector support and flex handling during PCBA.
Manufacturing Process
Manufacturing and Final Inspection
Production follows the approved regional stack and fabrication data. Electrical testing and final inspection follow the agreed scope; dynamic bend qualification is specified separately.
Data and DFM
Approve the regional stack, fabrication data and bend requirements.
Material Release
Prepare the selected rigid laminate, polyimide, copper and bonding materials.
Circuits and Interconnections
Form circuits and interconnections against the approved fabrication data.
Lamination and Drilling
Laminate the approved construction and control registration and hole locations.
Finish and Profile
Apply finish and profile the rigid and flex areas.
Inspection and Test
Complete electrical testing and agreed dimensional and visual inspection.
Supported Constructions
Rigid-Flex Builds We Support
Select a construction that fits your component areas, planned folds and assembly requirements.
Manufacturing profile
Two-Zone Rigid-Flex
Supported component areas connected through a defined flexible link.
- Inputs
- Fold direction, bend radius, rigid thickness, assembly requirements
- Decision
- Transition geometry and material stack-up
Manufacturing profile
Multi-Island Rigid-Flex
Multiple rigid areas with planned folds, support and assembly clearances.
- Inputs
- Layer map, via structure, impedance, placement
- Decision
- Stack-up, via structure, and test plan
Manufacturing profile
Panelized Rigid-Flex
Production panels designed for handling, registration and depaneling of selected constructions.
- Inputs
- Panel layout, tooling, carriers, assembly process
- Decision
- Panelization and assembly handling method
Request Your Rigid-Flex PCB Quote
Share your files and mechanical requirements. We will review the regional stack, transitions and manufacturing plan before confirming pricing and lead time.
FAQ
Rigid-Flex PCB Manufacturing Questions
What files are needed for a rigid-flex quote?
Send fabrication data, drill files, the regional stack-up, rigid and flex zone drawing, quantities and available bend, impedance, test or assembly requirements.
Can flex layers be outside or inside the stack?
Both outer-layer and middle-layer flex constructions can be reviewed. The approved position depends on the materials, copper, coverlay, transitions and assembly requirements.
Why does the rigid-flex transition need review?
The transition connects mechanically different regions. Routing, holes, coverlay, bonding material and support must be coordinated with the approved fold and movement conditions.
Can you review HDI rigid-flex designs?
Yes, subject to project evaluation. A 1+N+1 construction is a reference option. Higher-order build-ups and special via combinations require review of the stack-up and via map.
Can impedance be controlled in rigid-flex PCBs?
Yes, subject to construction review. Targets, tolerance, geometry and verification are defined for the rigid and flex regions, with agreed coupons and measurement methods.
Can fabrication be combined with PCBA?
Yes, subject to project scope. Send the BOM, placement data, assembly envelope, fixture and test requirements so fabrication and assembly can be planned together.