We support SMT, through-hole and mixed-technology PCB assembly, including 01005 placement and BGA assembly. Our engineering team reviews your Gerber files, BOM and placement data to plan sourcing, assembly, inspection and testing for your build.
We aim to provide an initial response within 24 hours. Share your quantity and test requirements so we can confirm the build scope and schedule.
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For detailed limits and project requirements, see the capability table below.
Compare our assembly, inspection and testing support with your project requirements.
| Capability | Available Support | Details to Confirm |
|---|---|---|
| Build model | Full-turnkey, partial-turnkey and consigned materials. | Approved sources, supply responsibilities and handling of shortages or excess materials. |
| Build quantity | No MOQ; prototypes, pilot runs and repeat production from 1 pc to 100K+. | Order quantity, material availability, panel format and production schedule. |
| Assembly process | Single- and double-sided SMT, through-hole and mixed-technology assembly. | Process sequence, heat-sensitive components, manual operations and cleaning. |
| Component size and pitch | 01005 placement. BGA packages with 0.4 mm pitch require project-specific approval. | Land pattern, stencil, component data, warpage and inspection plan. |
| Board format | Long-format boards up to 1,200 mm, subject to design and process review. | Width, thickness, panel rails, board support and depaneling requirements. |
| Workmanship and acceptance | Support for IPC Class 2 and Class 3 project requirements. | Applicable J-STD-001 and IPC-A-610 requirements, revisions and customer specifications. |
| Inspection | 3D SPI, 3D AOI, first article inspection and X-ray where specified. | Inspection coverage, sampling, acceptance limits and required reports. |
| Electrical testing | ICT and functional testing according to an agreed test plan. | Test access, fixture, program, limits and reporting requirements. |
| Programming and identification | Firmware loading and serialization. | Firmware version, programming method, serial-number format and verification. |
| Conformal coating | Coating for boards up to 700 × 400 mm. | Coating material, masking, keep-outs, thickness and curing requirements. |
| Traceability | Material and process records retained for up to 15 years on supported programs. | Required record fields, retention term, identification and customer reports. |
We check the first assembly against your BOM and drawings to verify component placement, polarity and assembly quality. Any issues are addressed before the batch proceeds.
3D SPI checks solder-paste deposits before placement. AOI checks visible component and solder features, including missing parts, orientation and applicable polarity markings.
X-ray inspection supports the assessment of hidden solder joints in BGA and other bottom-terminated packages. Inspection coverage and acceptance criteria are defined for each project.
ICT checks agreed electrical parameters; functional testing verifies specified operating functions. Fixtures, test programs, limits and result records are agreed before production.
Check board data, BOM, placement files, drawings and assembly requirements.
Confirm the sourcing model, approved parts and material readiness.
Plan stencil printing, placement, reflow and through-hole operations.
Complete the agreed first article, SPI, AOI and X-ray inspections.
Perform the specified electrical tests, functional tests and firmware loading.
Check finished assemblies and prepare the agreed inspection, test and traceability records.
For supported programs, we retain agreed material and process records for up to 15 years. Tell us which batch, serial-number and inspection records your quality team needs for repeat orders.
Review quality and traceabilityApproved source, material lot, date code and incoming inspection status, as required by the project.
Work order, assembly revision, production line and relevant process settings.
Agreed first article, SPI, AOI, X-ray and electrical test results.
Finished-product batch or serial numbers, final inspection status and shipment identification.
Explore assembly options for medical electronics, fine-pitch boards, industrial controls and programmed assemblies.
BOM revision control, traceability and documented inspections for repeat builds.
Small-component placement and hidden-joint inspection, with stencil and reflow planning matched to the design.
SMT and through-hole assembly for connectors, power components and mechanically supported parts.
Firmware loading and electrical or functional tests based on agreed programs, fixtures and limits.
Send the files you have, along with your quantity and delivery requirements. We will identify any additional information needed for quotation.
Gerber or ODB++, drill files and fabrication drawing.
BOM, pick-and-place file, assembly drawing and DNP notes.
Prototype or production quantity, target date and delivery destination.
IPC class, inspection, programming, functional test, coating and traceability requirements.
Find related assembly services, inspection equipment, quality controls and certification information.
PCB fabrication, component sourcing and assembly scope.
Open service page → EQUIPMENTSPI, AOI, X-ray and electrical testing equipment.
Review equipment → QUALITYInspection controls, production records and repeat-build traceability.
Review quality system → COMPLIANCECertificates and documents for supplier qualification.
Review compliance →Send your Gerber or ODB++ files, BOM, placement data, quantity and test requirements. Our engineering team will review the assembly scope and confirm the information needed for quotation.
Request an NDA
