What is the difference between SPI, AOI and X-ray inspection?
SPI measures solder-paste deposits before component placement. AOI uses optical imaging to check visible assembly features such as component presence, polarity…
Read answer →FAQ category
8 questions
When are ICT, flying-probe or functional tests used?
ICT and flying-probe testing check defined electrical nets or components, while functional testing verifies behavior under a customer-defined operating method.…
Read answer →What quality records can be defined for a project?
Project records can include incoming inspection results, first article records, process inspection data, AOI or X-ray evidence, electrical or functional test re…
Read answer →Does AOI replace electrical or functional testing?
No. AOI evaluates visible assembly features such as component presence, orientation and selected solder-joint conditions. It does not prove every electrical con…
Read answer →When is X-ray inspection needed for PCBA?
X-ray is useful when critical solder joints are hidden or cannot be assessed adequately by optical inspection, including many BGA, QFN and bottom-terminated pac…
Read answer →What is the difference between flying probe, ICT and FCT?
Flying probe and ICT check defined electrical connections or component conditions, while functional testing verifies the assembled product against an operating…
Read answer →How should PCBA acceptance criteria be defined?
Acceptance criteria should identify the applicable workmanship class or customer standard, critical components, inspection scope, sampling, test limits, cosmeti…
Read answer →What information is needed for failure analysis or a quality complaint?
Provide the affected quantity, lot or serial information, failure symptoms, operating conditions, photos, test data and whether the issue can be reproduced. Pre…
Read answer →