What is the difference between SMT, THT and mixed assembly?
SMT places surface-mount components on solder-paste deposits and normally uses reflow soldering. THT inserts leads through plated holes and may use wave, select…
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How are BGA and fine-pitch components controlled?
BGA and fine-pitch assembly require verified land patterns, suitable stencil design, controlled solder-paste printing, accurate placement and a stable reflow pr…
Read answer →What is a first article inspection for PCBA?
A first article inspection verifies the initial assembled board against released manufacturing data before the remaining production quantity proceeds. It can in…
Read answer →What files are needed for SMT assembly?
SMT assembly normally requires approved PCB data, a BOM with manufacturer part numbers, a pick-and-place or centroid file and an assembly drawing. Add stencil,…
Read answer →How is stencil thickness selected for PCBA?
Stencil thickness and aperture design depend on component mix, pad geometry, solder-paste volume, fine-pitch devices, thermal pads and step-stencil needs. A sin…
Read answer →Can SMT and through-hole components be assembled on the same board?
Yes. Mixed-technology PCBA can combine SMT reflow with through-hole wave, selective or hand soldering. The process sequence depends on component location, tempe…
Read answer →How are moisture-sensitive components handled?
Moisture-sensitive devices should be received, stored, exposed and baked according to the agreed handling requirements and the component moisture sensitivity le…
Read answer →Can you program ICs during PCBA production?
Programming can be included when the device, firmware, programming interface, security method and acceptance check are defined. Provide the controlled firmware…
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